International Conference on Physical Assurance and Inspection of Electronics 2026
A conference for researchers and practitioners working across hardware security, physical inspection, and supply chain assurance of electronics.
Phoenix, AZ
- Dates
- October 27–29, 2026
- Venue
- Phoenix, AZ
- Registration
- $995
TL;DR
- International Conference on Physical Assurance and Inspection of Electronics 2026 runs October 27–29, 2026 in Phoenix, AZ.
- Registration costs $995.
- The conference covers hardware security, physical inspection, and supply chain assurance of electronics.
- It brings together researchers and practitioners from academia, industry, and government.
About
PAINE brings together researchers and practitioners from academia, industry, and government to discuss hardware security, physical inspection, and supply chain assurance of electronics. Accepted papers are submitted for inclusion into IEEE Xplore, subject to IEEE Xplore scope and quality requirements. The documented topic scope includes threats facing chip designers, original equipment manufacturers, and system developers.
Who you'll find in the room
Researchers
Researchers in hardware security and electronics inspection.
Practitioners
Practitioners from academia, industry, and government.
Featured speakers
35 listedFarnood Rezaie
Technical Leader, Datacenter & AI Infrastructure · Cisco
Wayne Churaman
Team Leader · Army Research Laboratory
Krishnendu Chakrabarty
Fulton Professor of Microelectronics · Arizona State University
Chih-Hung Max Hsieh
Senior Product Manager · Siemens EDA
Marla L. Dowell
Executive Director, EDGE Consortium · Dartmouth College
Jason Killgore
Project Lead · NIST
Daniel Marrujo
President and Managing Director · Trusted Strategic Solutions, LLC
Neil Hubble
President · AkroMetrix, LLC
Yong Kim
AFRL
Antara Nandi
Program Manager · CHIPS R&D
Nelson Hastings
Cybersecurity and Privacy Applications Group · NIST
Eric Goodman
Principal Member Technical Staff · Sandia National Laboratories
Jeff Gelb
Director, X-Ray Control Technologies · Applied Materials
Christian Gil Ramiscal
Technical Staff Engineer · Microchip Technology Inc.
Krishna Pramod Madabhushi
Senior Principal IC Design Engineer · Medtronic
Felix Kim
Project Lead · NIST
Matthew Areno
Co-Chair of Secure Edge · Midwest Microelectronics Consortium
Jacob D. Rezac
Mathematical Statistician · NIST
Kyle Squires
Dean, Fulton Schools of Engineering · Arizona State University
Charles Woychik
VP Sales and Marketing · NHanced Semiconductors, Inc.
Carl E. McCants
Principal Engineer, Microelectronics SME · Intel Corporation
Darren Crum
Director of Microelectronics Lab · Purdue Applied Research Institute
June Lau
Physicist and Data Specialist · NIST
Debbie Black-Conn
WFD Lead · ME Commons
Alex Winslow
NNME Lead · SEMI Foundation
Martin J. Stevens
Group Lead · NIST
Erin Gawron-Hyla
Protective Technologies Team Lead · DEVCOM Army Research Laboratory
Tony Trinh
Senior Director, Advanced Concepts · Mercury Systems
Nathan Nakamura
Physicist · NIST
Ruth Hidalgo-Hernandez
Technical Leader · DOD
Jim Booth
Guided Wave EM Group Leader · NIST
Rong Pan
Professor · Arizona State University
Girish Wable
Project Manager · Semiconductor Research Corporation (SRC)
Khanh Kieu
Associate Professor of Optical Sciences · The University of Arizona
Jasper van Woudenberg
Senior Principal Security Technologist · Keysight Technologies
Questions people ask
6 answeredIt takes place October 27–29, 2026.
It is held in Phoenix, AZ.
Registration costs $995.
Researchers and practitioners from academia, industry, and government attend.
It may be worth attending when the agenda matches your priorities, the speakers fit your research or commercial goals, and the travel and registration costs fit the budget. Compare the program with your objectives before deciding.
Smart casual or business casual is a reasonable default for a technical professional conference. Choose comfortable shoes and check the organizer’s attendee guidance if published.
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